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Tresky 微電子取放 ( take & Place ) 系統解決方案

30多年來, Tresky一直不斷致力於完善取放 ( Take & Place) 系統技術.

作為解決方案提供者,TRESKY支援各種特定的應用製程以我們的高精度和創新系統。從手動到自動,從膠粘到工具,完全根據客戶的需求。這是透過我們豐富的經驗和模組化的設計,讓適合各種基本系統可搭配無數選配新技術。

 

手動, 半自動取放系統 ( Take & Place )

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應用:

Die Attach, Die Sorting, Flip-Chip, 3D Packaging / Stacking, MEMS, MOEMS, VCSEL, Photonics,Laser bar, Ultrasonic, Thermosonic, RFID, Sensor Assembly, Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, .....), ......

特色, 選配:

 Interface for all neccesary XYZ and T parameters, temperature profile, video imaging of up and down looking camera, Inspection or Flip-Chip.

 TRUE VERTICAL TECHNOLOGY™, Z-movement 95mm with motorized 360° Tool rotation; Dispenser, Stamping, Ultrasonic, Scrub,Tool Heating, Pre Form Spindle, ...

 Motorized XY placement stage supporting: Waffle/Gel - Pack -, Substrate - Holder, various Heating Plates or other Fixtures

 Pick-up from Wafer with Tresky‘s patented die ejector system, especialy suitable for all kind of Si, GaAs and InP dies down to 30μm thickness.

技術資料:

 XY- Movement (placement stage):220mm x 220mm (automatic)

 XY- Movement (wafer stage):220mm x 220mm (manual)

 Z- Movement:95mm (automatic)

 Spindle Rotation:360° (manual / optional: automatic)

 Bond Force (standard range):40g - 400g (other force ranges available)

 Bond Force (repeatability):±1g

 Z-Measurement resolution:±0.001mm

 Max. PC Board-/ Substrate Size:400mm x 280mm

 Placement accuracy:±5μm

 Connections:Compressed air 5 - 6 bar / Vacuum 0.6 bar (abs)

 Dimensions:900mm x 800mm x 700mm

 Weight:11kg

 Voltage:110V / 220V

 

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 Tresky T-3202.pdf

 Tresky T-3002-FC3.pdf

 Tresky T-3002-M.pdf

 Tresky T-4909.pdf 

 

全自動取放系統 ( take & Place )

在T-8000 晶片接合機是一個完全自動化的通用系統, 適合研發和中型量產。花崗岩平台, 配備線性馬達及0.1μm精度使接合精度可以到達5µm精度。

接合力範圍從10g到25kg,配合500×450mm大工作區和可處理晶圓到達12“,支援廣泛的應用範圍。及眾多的可用選配,將T-8000可以客製最適合您的需求。 

proimages/product/03/03-4/T-8000-320.jpg

特點:

• Customized substrate holders and fixtures available

• Wafer ring or wafer frame holders

• Automatic 3-D and force calibration

• Flux dipping station

• Up looking camera

• Dispenser (Time/ Pressure or volumetric)

• Stamping unit

• Automatic tool changer (optional for heated tools)

• Eutectic bonding unit with protective gas chamber

• Customized substrate holders and fixtures available

• Wafer ring or wafer frame holders

• Automatic 3-D and force calibration

• Flux dipping station

• SMD feeder capability (8 and 12mm)

 

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 Tresky T-8000.pdf

 Tresky T-6000L.pdf